Punjab Engineering College (Deemed to be University) and Cadence Design Systems (India) have signed a Memorandum of Understanding (MoU) for a long-term partnership. The agreement was signed by Prof. Baldev Setia, Director of Punjab Engineering College (PEC), and Vijayakumar C Patil, Application Engineering Group Director at Cadence. The signing ceremony was held in the presence of Prof. Arun Kr. Singh, Head of the Electronics and Communication Engineering (ECE) Department, Dr. Jyoti Kedia, BTech VLSI Coordinator, and other faculty members of the ECE Department.

Through this partnership, PEC and Cadence will collaborate to enhance, improve, and extend the knowledge, capabilities, and expertise of the ecosystem in general, and the students of PEC in particular. The collaboration will focus on aligning the PEC curriculum with industry-relevant challenges, offering new opportunities for internships to provide industry experience to PEC students during their studies and placements, and providing access to Cadence's award-winning online training content.

Jaswinder Ahuja, corporate vice president and India Managing Director, Cadence, said, "Cadence has been closely involved in workforce development in India for the last 25 years. According to a report by the Semicon India Future Skills Talent Committee set up in August 2022 says that India will need 12 lakh workers in semiconductor-related industries by 2032. Initiatives such as this one will help train students in real-life projects and make them industry-ready. We are proud to collaborate with PEC for this MOU".